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Topological States on Interfaces Protected by Symmetry (Springer Theses) Cover Image
Topological States on Interfaces Protected by Symmetry (Springer Theses) (Hardcover) By Ryuji Takahashi $139.99
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Micromanufacturing and Nanotechnology Cover Image
Micromanufacturing and Nanotechnology (Paperback) By Nitaigour P. Mahalik $159.99
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Dropwise Condensation on Inclined Textured Surfaces Cover Image
Dropwise Condensation on Inclined Textured Surfaces (Paperback) By Sameer Khandekar, Krishnamurthy Muralidhar $74.99
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The Engineering Approach to Winter Sports Cover Image
The Engineering Approach to Winter Sports (Hardcover) By Francesco Braghin (Editor), Federico Cheli (Editor), Stefano Maldifassi (Editor) $169.99
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Thin Liquid Films: Dewetting and Polymer Flow (Theoretical and Mathematical Physics) Cover Image
Thin Liquid Films: Dewetting and Polymer Flow (Theoretical and Mathematical Physics) (Hardcover) By Ralf Blossey $109.00
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Corrosion Inhibitors, Principles and Recent Applications Cover Image
Corrosion Inhibitors, Principles and Recent Applications (Hardcover) By Mahmood Aliofkhazraei (Editor) $155.00
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Advances in Contact Angle, Wettability and Adhesion, Volume 4 Cover Image
Advances in Contact Angle, Wettability and Adhesion, Volume 4 (Hardcover) By K. L. Mittal (Editor) $225.00
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Organic-Inorganic Composite Membranes for Molecular Separation (Chemical Engineering #5) Cover Image
Organic-Inorganic Composite Membranes for Molecular Separation (Chemical Engineering #5) (Hardcover) By Wanqin Jin, Gongping Liu, Nanping Xu $148.00
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Spin-Polarized Two-Electron Spectroscopy of Surfaces Cover Image
Spin-Polarized Two-Electron Spectroscopy of Surfaces (Paperback) By Sergey Samarin, Oleg Artamonov, Jim Williams $149.99
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Remarkable Natural Material Surfaces and Their Engineering Potential Cover Image
Remarkable Natural Material Surfaces and Their Engineering Potential (Hardcover) By Michelle Lee (Editor) $37.99
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Helium Ion Microscopy (Nanoscience and Technology) Cover Image
Helium Ion Microscopy (Nanoscience and Technology) (Hardcover) By Gregor Hlawacek (Editor), Armin Gölzhäuser (Editor) $279.99
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Encyclopedia of Packaging Materials, Processes, and Mechanics - Set 1: Die-Attach and Wafer Bonding Technology (a 4-Volume Set) Cover Image
Encyclopedia of Packaging Materials, Processes, and Mechanics - Set 1: Die-Attach and Wafer Bonding Technology (a 4-Volume Set) (Hardcover) By Avram Bar-Cohen (Editor in Chief), Jeffrey C. Suhling (Editor in Chief), Andrew A. O. Tay (Editor in Chief) $1,350.00
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